
Jim Lai has more than 22 years of experience in semiconductor
and ASIC industries. Jim currently serves as president and COO
of Global Unichip Corp.
Mr. Lai was promoted from TSMC North America to GUC in 2003
when TSMC became the major shareholder of GUC. From 1992 to
2003, Jim served various positions at TSMC North America,
including director of emerging account, director of design
services and business manager responsible for the ASIC business
unit.
Prior to TSMC, Mr. Lai co-founded ASICtronics, one of the
earliest design service companies to provide ASIC design consultation
and libraries. Prior to ASICtronics, Mr. Lai worked at Toshiba
America, Knights Technology and LSI Logic in various engineering
positions in ASIC and CAD groups.
Mr. Lai received his Master of Science degree in Electrical
Engineering from University of California, Santa Barbara in
1984 and his Bachelor of Science degree in Electrical Engineering
from National Taiwan University in 1981.
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