• - Bit Embedded SRAM
• - USB 2, SATA 2, DDR2@1033MHz
• - ARM A9 Dual core @ 1.2GHz

• - Triple Gate Oxide Process
• - DDR2, LVDS, XAUI, SerDes (1G/10G)
• - Flip Chip Package Design

8.5M 

• - ARM926 ,SerDes (1G/10G)
• - DDR2, LVDS, HSTL, XAUII
• - Flip Chip Package Design

• - TSMC STD Cell @ 1GHz
• - GPON PHY, SGMII PHY, PCIE PHY
• - DDR2/3 PHY / Controller, USB 2, PLL

• - ARM Cortex A9@ 1.2GHz Speed
• - DDR 2, SATA 2, USB 2, eDRAM
• - SiP Package with Flip Chip Design

• - ARM926/ETB/ ETM9 x 4
• - Virage STD 9T/12T with Multi Channel
• - DDR 2, SRIO x4, SerDes 4 Lane x4

• - Triple Gate Oxide Process
• - SiP Package/Low Power Design
• - USB 2, mDDR, ARM Cortex R4

• - SiP Package /Low Power Design
• - 40M Embedded SRAM
• - USB 2, mDDR

• - 37M Embedded SRAM
• - DSP Core, DDR 2, USB 2, ADC, DAC
• - Flip Chip Package Design

• - 8.7M Bit Embedded SRAM
• - DDR 2/3, USB 2, SATA 2
• - ARM Cortex A9@1.2GHz Speed

• - Synopsys DDR3
• - Cadence SerDes

• - 13.5M Bits Embedded SRAM
• - ARM926 Core
• - DDR2/3 Combo

• - ARM926 Core
• - SerDes, DDR2/3 Combo

• - 11.5M Bits Embedded SRAM
• - ARM926926EJS / ETM9
• - LVDS, ADC, DAC, OSC
   

• - 5.8M Bits Embedded SRAM
• - ARM1176JZF, DDR2 @ 800MHz
• - USB x3, DAC, ADC

• - 11.5M Bits Embedded SRAM
• - ARM926926EJS / ETM9
• - LVDS, ADC, DAC, OSC

• - 3M Bits Embedded SRAM
• - GUC LVDS, ADC, DAC, eDRAM

• - 42M Bits Embedded SRAM
• - DDR 2/3 Combo, LVDS

• - 24M bits Embedded SRAM
• - DDR 2 PHY/ Controller
• - sRIO PHY/ Controller