|
Multi-Standard
SerDes
|
10G-KR KX
|
28nm
|
1.25Gbps ~ 12.5Gbps
|
|
CEI-11G, 6G-LR/SR
|
|
PCIe 3.0
|
|
SATA/SAS 3.0
|
|
10G-KR Multi-Rate
|
28nm ~ 40nm
|
1.25Gbps ~ 12.5Gbps
|
|
10G-EPRON/GPON
|
28nm ~ 40nm
|
1.0Gbps ~ 10.3125 Gps
|
|
|
28nm ~ 40nm
|
2.5Gbps / 5.0Gbps / 8.0Gbps
|
|
XAUI / SRIO
|
40nm
|
3.125Gbps
|
|
SATA 3.0/SAS 2.0
|
90nm
|
1 .5Gbps / 3Gbps / 6Gbps
|
|
USB 3.0
|
40nm ~ 65nm
|
5Gbps
|
|
DDR 2/3, LPDDR 2
|
28nm ~ 65nm
|
667Mbps ~ 2.133Gbps
|
|
|
- Successfully deployed in 20+ customer projects
- IP total solution with MAC/PCS/PMA
- SoC test mode integration
- Test pattern generation & At speed production test
 |
- Production Proven Package Design Service Solutions
|
- Experience in domain IP design, sourcing & qualification
- Signal integrity & noise immunity prevention
- Chip + package electrical design & test solutions
|
|
- 3D Substrate Parasitic Extraction
|
- Accurate 3D package substrate parasitlc extraction
- Electrical timing and frequency response simulation
- Thermal effect of package and material selection
- Predictable solution for turnkey and ASIC design
|
| |
- 3D Extraction & Simulation Example
|
|
- Production Test Solutions
|
- Experienced engineering team and in-house equipment for fast test program development
- In-house test equipment of Verigy A93000 and Teradyne J750
- Robust supply chain via solid test vendor collaboration
|
|
