- High Speed Interface Design Solution
|
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|
SerDes |
40nm
~ 90nm |
1Gbps
~ 13Gbps |
|
PCI Express |
40nm
~ 0.13um |
2.5Gbps
/ 5Gbps / 8Gbps |
|
XAUI / SRIO |
40nm
~ 90nm |
3.125Gbps |
| Serial
ATA / SAS |
40nm ~ 90nm |
1.5Gbps / 3.0Gbps
/ 6.0Gbps |
| USB3 |
40nm
~ 90nm |
5Gbps |
| DDRx |
40nm ~ 0.18um |
200Mbps ~ 1.6Gbps |
| LVDS |
40nm
~ 0.25um |
100Mbps
~ 1.5Gbps |
|
- GUC 40nm in-house solution along with
3rd party vendor partnership
- Quality IP design and sourcing
- SoC test mode integration
- Test pattern generation
- At speed production test
|
- Production Proven Design Service Solutions
|
- Experienced domain IP design, sourcing
& qualification
- Signal integrity & noise immunity
prevention
- Chip + package electrical design &
test solutions
|
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- 3D Substrate Parasitic Extraction
|
- Accurate 3D package substrate parasitlc
extraction
- Electrical timing and frequency response
simulation
- Thermal effect of package and material
simulation
- Predictable solution for turnkey and ASIC design
|
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- 3D Extraction & Simulation Example
|
|
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- Production Test Solutions
|
- Experienced engineering team and in-house
equipment for fast test program development
- In-house test equipment of Verigy A93000
and Teradyne J750
- Robust supply chain via solid test vendor
collaboration
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