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GUC offers customers our professional and
quality manufacturing service through collaboration with partners
of world class wafer fab, packaging & testing houses, as
well as other supporting providers to minimize entry barriers
and technical risks, to enable shorter time-to-market, time-to-volume,
and to ensure punctual delivery with good quality and yield
for customers, so as to let customers focus resources on their
core competency.
This service will also be provided to customers who need Manufacturing
Service only rather than other excellent services of Chip Design
and Implementation which GUC offers too. The SoC manufacturing
services consists of services for Packaging, Testing, Product,
Quality & Reliability, as well as Supply Chain Management.
System-in Package(SiP) service is also provided to enhance and
differentiate product competitiveness for customers by taking
advantages of GUC’s professional expertise in whole SoC design
and supply chains. |
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This is to provide Package design, development
services as details listed below, Key features of our Packaging
Service are as follows
- Chip/Package/Board co-design and co-simulation
- Package level electrical/thermal/mechanical
simulation
- System-in-Package ( This is being addressed
in separate section of this website. )
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