| GUC delivers a one-stop turnkey solution
via its in-house capabilities, partnership with TSMC and the
whole value chain through wafer sort, package design/assembly,
final test, packing and shipment.
In collaboration with GUC's specialty and top tier suppliers'
expertise, GUC provides full spectrum engineering services,
covering product engineering, test engineering, package engineering
and reliability engineering services.
With transparent WIP report and the best management of the
entire value chain, GUC turnkey services provide on-time delivery
and variety of production services, including probed wafers,
packaged devices, and tested packaged devices. |
