•Per JEDEC/ EIAJ/ AEC/ MIL STD Standards
•L1/L2 Qual. Proposal by Application/ Grade/
Life& ppm Target
•MTTF/FIT Estimation thru Reliability Model
•Do Qualification, and Provide Qual. Report
•RoHS/Hazardous Substance Control

•Regular Wafer Process Reliability Monitoring
•Regular Assembly Process Reliability Monitoring
•ELFR Test for Initial_production Lots *
•Regular Product Reliability Monitoring (HTOL/TCT) *
•Process/Functional Yield Monitoring
•Statistical Yield/Bin Limit Control*
•Production Burn-in *
•Bench Testing *

•ATE(CP/FT) Test Coverage Control
•Correlation between ATE/System
•Characterization*
•Stress Testing (Voltage/Temperature) of CP/FT
•Out-of-box Audit Test *
•Low ppm Program *
•Automotive Program *

•Production Quality KPI / QBR
•Change Control
•SPC Monitor
•Nonconforming/MRB Control
•100% Chips Visual Scanning
•On-site QC Checking
•Continuous Improvement Program / CAR

*: optional