| ¡¶ |
Example of 5-layer stacked dies
(SoC + 2 MDDRs) SiP configuration |
| ¡¶ |
Example of Package on Package (PoP) in which both top (LFBGA) and bottom
(FCBGA) packages are SiPs. |
PHY
| ¡¶ |
Example of stacked and side-by-side configured SiP of SoC, SDRAM and
PHY. |
| ¡¶ |
Example of side-by-side configured SiP of SoC, RF and ~20 passive components. |
PKG
type: 469-Ball LFBGA
PKG size: 14 mm x 14 mm
Application: Multimedia Platform
PKG
type: 176-Ball TFBGA
PKG size: 12 mm x 12 mm
Application: Mobile TV
RF
SoC
Passive
4L
NPL substrate
4L
NPL substrate
ASIC
SDRAM
