Customer & GUC

• SOW signed

Customer

• SiP request form
• Spec. & constraint

Customer

• N2G/R2G data-in

Customer

• Post-layout sign-off

GUC

• KGD selection
• APR feasibility study
• SiP structure selection
• Package selection
• Production test feasibility study
• Cost assessment

GUC

• DFT/BIST solution
• Preliminary floor plan
• KGD confirmation
• Test confirmation
• Package confirmation
• Preliminary bonding check

GUC

• APR timing closure
• Floor plan & IO refinement
• Final bonding check
• HS I/F time domain simulation
• Package RLCG extraction
• SI/PI simulation
• Electrical/thermal simulation

Final Chip/Package/Board
Co-design