President Jim Lai is invited to give a speech on "Where Taiwan Stands in Facing 3D-IC Challenges and Opportunities?" at 2010 VLSI CAD.
 Where Taiwan Stands in Facing 3D-IC Challenges and Opportunities? SoC design is facing relentless demand for higher bandwidth, lower power, smaller form factor and more function integration. The traditional solution depends on CMOS scaling based on Moore’s law is becoming a daunting effort as device feature shrinks beyond 40nm. 3D Packaging with TSV interconnects provides another possible path to meet the demands mentioned above. Even though 3D Packaging with wire-bond stacked chips has already been widely used in the SoC industry, there are many challenges like IO standardization, thermal management, testability, reliability, proper EDA tools, business infrastructure and supply chain management plagued the more advanced TSV interconnect scheme. This talk will address how Taiwan can leverage the chip design and manufacturing infrastructure and the experience learned from 3D Packaging with wire-bond stacked chips to expedite solutions for the hurdles aforementioned.  創意電子 賴俊豪 總經理
Please visit the website for more information: http://vlsicad2010.ee.ncku.edu.tw/ |
