Hsinchu, Taiwan-July. 27, 2009- Global Unichip Corp. ( GUC; TW: 3443 ), the world's leading Design Foundry service provider, announced today the application and validation of System-in-Package ( SiP ) design solution in TSMC Reference Flow 10.0 as the fruit of collaboration with TSMC.  The SiP methodology has been fully qualified with GUC production case and achieved good silicon correlation.

The SiP Flow provides die-to-package co-design with comprehensive SiP design analysis such as component timing, IR drop, signal-integrity/simultaneous switching noise, and thermal analysis. The SiP flow also offers die-to-package DRC/LVS verification solutions and electrical, physical design guideline. The SiP timing has been correlated to silicon data with high accuracy.

"TSMC Reference Flow 10.0 enables designers to effectively use package design capability to deliver a more competitive component." said ST Juang, Senior Director of Design Infrastructure Marketing at TSMC......Read More>>